Kester 7006050810 Solder Paste, EM907, Sn96.5Ag3Cu0.5 (SAC305), No-Clean, Type 3, 88.5%, 500 Gram Jar

Kester 7006050810 is EM907 EnviroMark lead-free, air and nitrogen reflowable no-clean solder paste specifically designed for the thermal requirements of lead free alloys, including the Sn96.5Ag3.0Cu0.5 alloy. Kester 907 EnviroMark lead free solder paste is a air and nitrogen reflowable no-clean solder paste specifically designed for the thermal requirements of lead free alloys, including the Sn96.5Ag3.0Cu0.5 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. EM907 is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6"/s (150 mm/s). This solder paste also exceeds the reliability standards required by J-STD-004. Note: This part number was formerly known as Kester 57-3043-9909.
Please note: Due to refrigeration requirements, this item must be shipped overnight.For International Orders (out of the United States) product will be shipped International Priority.