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CircuitMedic CT006025AS is a circuit frame conductor .006 " / 0.25" (.152 mm / .635 mm) with bright tin plating and is RoHS compliant.
Imagine replacing damaged surface mount pads, lands and conductors without the mess of liquid epoxy, with a bond strength equal to the original, in just a few minutes. Circuit Frames with dry-film adhesive backing make this delicate repair procedure easy, fast and highly reliable.
This reliable IPC recommended procedure meets the highest conformance level for this type of repair. For over 30 years Circuit Frames have been used by thousands of commercial, medical and military manufacturers around the globe.
Features of the CIRÂ CT006025AS:
Overall Frame Size: 2.25" x 1.50" (57 x 38 mm)
Base Material: Rolled annealed copper foil .0014" (.036 mm) thick
Adhesive Backing: B-staged modified acrylic film adhesive .002" (.051 mm) thick
Certification: Adhesive backing is certified to IPC-4203/18: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
Solder Resistance: Passes IPC Spec 10 sec at 288 Degree C (550 Degree F)
Bonding Temperature: 475 Degree F /- 25 Degree F
Bonding Time: 30 seconds
Peel Strength: Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material
Shelf Life: 1 year minimum. Each Circuit Frame package is stamped with the expiration date.
Plating: .0001" (.0025 mm) Bright Tin (Lead Free)
RoHS and REACH: CircuitMedic Circuit Frames contain less than 0.1% by weight any substance listed as a very high concern in Article 59 of REACH
Outgassing: The Bonding Film used on Circuit Frames consistently meets the criteria for NASA applications: Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366, %TML: 0.94%, %CVCM: 0.06%
RoHS Compliant: Compliant
Related Items for the CIR CT006025ASÂ (Not Included):
CIR 115-3102: Bonding Iron, 120 VAC
CIR 115-3103: Bonding Iron, 230 VAC
CIR 115-3118: Bonding System to Cure Adhesive Bonding Film
CIR 115-2104: Bonding Tip, Tapered
CIR 115-2201: Bonding Tip, .025" (.64 mm) Diameter
CIR 115-2202: Bonding Tip, .060" (1.52 mm) Diameter
CIR 115-2204: Bonding Tip, .080" (2.03 mm) Diameter
CIR 115-2205: Bonding Tip, .035" (.89 mm) Diameter
CIR 115-2206: Bonding Tip, .120" (3.05 mm) Diameter
CIR 115-2301: Bonding Tip, .010" x .080" (.25 mm x 2.03 mm)
CIR 115-2306: Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm)
CIR 115-2308: Bonding Tip, .045" x .110" (1.14 mm x 2.79 mm)
CIR 115-2310: Bonding Tip, .050" x .050" (1.27 mm x 1.27 mm)
CIR 115-2312: Bonding Tip, .060" x .080" (1.52 mm x 2.03 mm)
CIR 115-2316: Bonding Tip, .080" x .120" (2.03 mm x 3.05 mm)
CIR 115-2318: Bonding Tip, .080" x .500" (2.03 x 12.70 mm)
CIR 115-2320: Bonding Tip, .095" x .095" (2.41 mm x 2.41 mm)
CIR 115-2322: Bonding Tip, .120" x .500" (3.05 mm x 12.70 mm)
Discontinued | No |
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Brand | CircuitMedic |
Manufacturer | Circuit Medic |
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