CIR CS048068AS

CIR CS048068AS
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CircuitMedic CS048068AS Circuit Frame Surface Mount Pad .048 x .068 In

Part #: CIR CS048068AS
MSRP: $44.00 EA
Price: $41.80 EA
Minimum Order Qty: 8
Must be Purchased in Multiples of: 8
Leadtime: Please see availability listed below.
Stock items ship in 24-48 hours.
If stock is not available, CircuitMedic
items ship 7-10 days after receipt of order.


Circuit Medic CS048068AS is a circuit frame surface mount pad .048"x.068" (1.219 mm x 1.727 mm) with bright tin plating. This item features dry-film adhesive backing which make this circuit board repair procedure easy, fast and highly reliable.  Additionally, CIR CS048068AS allows users to replace damaged surface mount pads, lands and conductors without the mess of liquid epoxy, with a bond strength equal to the original, in just a few minutes. This is a reliable IPC recommended procedure which meets the highest conformance level for this type of repair. For over 30 years, circuit frames have been used by thousands of commercial, medical and military manufacturers around the globe.

Features of the CS048068AS:

Overall Frame Size: 2.25" x 1.50" (57 x 38 mm)

Base Material: Rolled annealed copper foil .0014" (.036 mm) thick

Adhesive Backing: B-staged modified acrylic film adhesive .002" (.051 mm) thick

Certification: Adhesive backing is certified to IPC-4203/18: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films

Solder Resistance: Passes IPC Spec 10 sec at 288 Degree C (550 Degree F)

Bonding Temperature: 475 Degree F /- 25 Degree F

Bonding Time: 30 seconds

Peel Strength: Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material

Shelf Life: 1 year minimum. Each Circuit Frame package is stamped with the expiration date.

Plating: .0001" (.0025 mm) Bright Tin (Lead Free)

RoHS and REACH: CircuitMedic Circuit Frames contain less than 0.1% by weight any substance listed as a very high concern in Article 59 of REACH

Outgassing: The Bonding Film used on Circuit Frames consistently meets the criteria for NASA applications: Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366, %TML: 0.94%, %CVCM: 0.06%

RoHS Compliant: Compliant

Related Items for the CIR CS048068AS (Not Included):

CIR 115-3102: Bonding Iron, 120 VAC

CIR 115-3103: Bonding Iron, 230 VAC

CIR 115-3118: Bonding System to Cure Adhesive Bonding Film

CIR 115-2104: Bonding Tip, Tapered

CIR 115-2201: Bonding Tip, .025" (.64 mm) Diameter

CIR 115-2202: Bonding Tip, .060" (1.52 mm) Diameter

CIR 115-2204: Bonding Tip, .080" (2.03 mm) Diameter

CIR 115-2205: Bonding Tip, .035" (.89 mm) Diameter

CIR 115-2206: Bonding Tip, .120" (3.05 mm) Diameter

CIR 115-2301: Bonding Tip, .010" x .080" (.25 mm x 2.03 mm)

CIR 115-2306: Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm)

CIR 115-2308: Bonding Tip, .045" x .110" (1.14 mm x 2.79 mm)

CIR 115-2310: Bonding Tip, .050" x .050" (1.27 mm x 1.27 mm)

CIR 115-2312: Bonding Tip, .060" x .080" (1.52 mm x 2.03 mm)

CIR 115-2316: Bonding Tip, .080" x .120" (2.03 mm x 3.05 mm)

CIR 115-2318: Bonding Tip, .080" x .500" (2.03 x 12.70 mm)

CIR 115-2320: Bonding Tip, .095" x .095" (2.41 mm x 2.41 mm)

CIR 115-2322: Bonding Tip, .120" x .500" (3.05 mm x 12.70 mm)

Prices subject to change without notice. Stock can change at any time. Prices are for online orders only. Stock items typically ship in 24-48 hours. Special orders with the manufacturer vary and are subject to their leadtimes.

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