CIR CS038090AS

CIR CS038090AS
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CircuitMedic CS038090AS Circuit Frame Surface Mount Pad .038 x .090 In

Part #: CIR CS038090AS
MSRP: $44.00 EA
Price: $41.80 EA
Minimum Order Qty: 8
Must be Purchased in Multiples of: 8
Leadtime: Please see availability listed below.
Stock items ship in 24-48 hours.
If stock is not available, CircuitMedic
items ship 7-10 days after receipt of order.


Circuit Medic CS038090AS is a circuit frame surface mount pads .038 " x .090" (.965 x 2.286 mm) with bright tin plating and is RoHS compliant. This item features dry-film adhesive backing which make this circuit board repair procedure easy, fast and highly reliable.

Features of the CS038090AS:

Overall Frame Size: 2.25" x 1.50" (57 x 38 mm)

Base Material: Rolled annealed copper foil .0014" (.036 mm) thick

Adhesive Backing: B-staged modified acrylic film adhesive .002" (.051 mm) thick

Certification: Adhesive backing is certified to IPC-4203/18: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films

Solder Resistance: Passes IPC Spec 10 sec at 288 Degree C (550 Degree F)

Bonding Temperature: 475 Degree F /- 25 Degree F

Bonding Time: 30 seconds

Peel Strength: Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material

Shelf Life: 1 year minimum. Each Circuit Frame package is stamped with the expiration date.

Plating: .0001" (.0025 mm) Bright Tin (Lead Free)

RoHS and REACH: CircuitMedic Circuit Frames contain less than 0.1% by weight any substance listed as a very high concern in Article 59 of REACH

Outgassing: The Bonding Film used on Circuit Frames consistently meets the criteria for NASA applications: Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366, %TML: 0.94%, %CVCM: 0.06%

RoHS Compliant: Compliant

Related Items for the CIR CS038090AS (Not Included):

CIR 115-3102: Bonding Iron, 120 VAC

CIR 115-3103: Bonding Iron, 230 VAC

CIR 115-3118: Bonding System to Cure Adhesive Bonding Film

CIR 115-2104: Bonding Tip, Tapered

CIR 115-2201: Bonding Tip, .025" (.64 mm) Diameter

CIR 115-2202: Bonding Tip, .060" (1.52 mm) Diameter

CIR 115-2204: Bonding Tip, .080" (2.03 mm) Diameter

CIR 115-2205: Bonding Tip, .035" (.89 mm) Diameter

CIR 115-2206: Bonding Tip, .120" (3.05 mm) Diameter

CIR 115-2301: Bonding Tip, .010" x .080" (.25 mm x 2.03 mm)

CIR 115-2306: Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm)

CIR 115-2308: Bonding Tip, .045" x .110" (1.14 mm x 2.79 mm)

CIR 115-2310: Bonding Tip, .050" x .050" (1.27 mm x 1.27 mm)

CIR 115-2312: Bonding Tip, .060" x .080" (1.52 mm x 2.03 mm)

CIR 115-2316: Bonding Tip, .080" x .120" (2.03 mm x 3.05 mm)

CIR 115-2318: Bonding Tip, .080" x .500" (2.03 x 12.70 mm)

CIR 115-2320: Bonding Tip, .095" x .095" (2.41 mm x 2.41 mm)

CIR 115-2322: Bonding Tip, .120" x .500" (3.05 mm x 12.70 mm)

Prices subject to change without notice. Stock can change at any time. Prices are for online orders only. Stock items typically ship in 24-48 hours. Special orders with the manufacturer vary and are subject to their leadtimes.

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