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Features of the CIRÂ CS020028AT:
Overall Frame Size: 2.25" x 1.50" (57 x 38 mm)
Base Material: Rolled annealed copper foil .0014" (.036 mm) thick
Adhesive Backing: B-staged modified acrylic film adhesive .002" (.051 mm) thick
Certification: Adhesive backing is certified to IPC-4203/18: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
Solder Resistance: Passes IPC Spec 10 sec at 288 Degree C (550 Degree F)
Bonding Temperature: 475 Degree F /- 25 Degree F
Bonding Time: 30 seconds
Peel Strength: Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material
Shelf Life: 1 year minimum. Each Circuit Frame package is stamped with the expiration date.
Plating: .0001" (.0025 mm) Bright Tin 63/37 Tin/Lead
RoHS and REACH: CircuitMedic Circuit Frames contain less than 0.1% by weight any substance listed as a very high concern in Article 59 of REACH
Outgassing: The Bonding Film used on Circuit Frames consistently meets the criteria for NASA applications: Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366, %TML: 0.94%, %CVCM: 0.06%
RoHS Compliant: Non Compliant
Related Items for the CIR CS020028ATÂ (Not Included):
CIR 115-3102: Bonding Iron, 120 VAC
CIR 115-3103: Bonding Iron, 230 VAC
CIR 115-3118: Bonding System to Cure Adhesive Bonding Film
CIR 115-2104: Bonding Tip, Tapered
CIR 115-2201: Bonding Tip, .025" (.64 mm) Diameter
CIR 115-2202: Bonding Tip, .060" (1.52 mm) Diameter
CIR 115-2204: Bonding Tip, .080" (2.03 mm) Diameter
CIR 115-2205: Bonding Tip, .035" (.89 mm) Diameter
CIR 115-2206: Bonding Tip, .120" (3.05 mm) Diameter
CIR 115-2301: Bonding Tip, .010" x .080" (.25 mm x 2.03 mm)
CIR 115-2306: Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm)
CIR 115-2308: Bonding Tip, .045" x .110" (1.14 mm x 2.79 mm)
CIR 115-2310: Bonding Tip, .050" x .050" (1.27 mm x 1.27 mm)
CIR 115-2312: Bonding Tip, .060" x .080" (1.52 mm x 2.03 mm)
CIR 115-2316: Bonding Tip, .080" x .120" (2.03 mm x 3.05 mm)
CIR 115-2318: Bonding Tip, .080" x .500" (2.03 x 12.70 mm)
CIR 115-2320: Bonding Tip, .095" x .095" (2.41 mm x 2.41 mm)
CIR 115-2322: Bonding Tip, .120" x .500" (3.05 mm x 12.70 mm)
California Proposition 65 | Not applicable |
---|---|
Discontinued | No |
Brand | CircuitMedic |
Manufacturer | Circuit Medic |