CircuitMedic B4-676-3131-102 Flextac BGA Rework Stencil Pack of 10

Special Order
SKU
circuit-medic-b4-676-3131-102
Previous
CircuitMedic B4-676-2727-100 Flextac BGA Rework Stencil Pack of 10

circuit-medic-b4-676-2727-100

CircuitMedic B4-676-2727-100 Flextac BGA Rework Stencil Pack of 10

Next
CircuitMedic B4-680-3535-100 Flextac BGA Rework Stencil Pack of 10

circuit-medic-b4-680-3535-100

CircuitMedic B4-680-3535-100 Flextac BGA Rework Stencil Pack of 10

$170.05
CircuitMedic B4-676-3131-102 are Flextac BGA rework stencils with a thickness of .004" (0.102 mm), aperture: .020" (0.508 mm), balls: 676, pitch: .039" (1.00 mm), component: 31 x 31 mm, and sold in a pack of 10.
CircuitMedic B4-676-3131-102 Flextac BGA Rework Stencil Pack of 10 is available to buy in increments of 10
Minimum Order Qty: 10
Must be Purchased in Multiples of: 10
Inventory: 0
Lead time: Please see availability listed above.
Stock items ship in 24-48 hours.
If stock is not available, CircuitMedic
items ship 7-10 days after receipt of order.

Circuit Medic B4-676-3131-102 are Flextac BGA rework stencils with a thickness of .004" (0.102 mm), aperture: .020" (0.508 mm), balls: 676, pitch: .039" (1.00 mm), component: 31 x 31 mm, and sold in a pack of 10.

CircuitMedic stencils are self-sticking solder paste stencils. These laser cut, polymer stencils use a full-release, residue-free adhesive similar to sticky notes. The self-sticking adhesive on the bottom of the stencil seals around each BDA pad to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable CircuitMedic stencils are easy to use and will not leave any reside on the board surface.

The CIR B4-676-3131-102 stencils are better in comparison to metal stencils, as with metal stencils users must fixture or tape them in position in order to hold in place. Additionally, metal stencils can warp, and if the circuit board has undulations in the board surface, the metal stencil will not sit flat. Since there is no gasket-like seal, solder paste can easily bleed under metal stencils when paste is applied with a squeegee. Also solder paste can spill out over the sides of flat stencils contaminating the circuit board surface.

US Patent number: 6,253,675


Related Items for the CIR B4-676-3131-102:

CIR 115-3504: Stainless Steel Squeegee Blade, 12 mm Wide

CIR 115-3506: Stainless Steel Squeegee Blade, 27 mm Wide

CIR 115-3508: Stainless Steel Squeegee Blade, 35 mm Wide

CIR 115-3502: Squeegee Blade Used to Spread Solder Paste

More Information
Discontinued No
Brand CircuitMedic
Manufacturer Circuit Medic
Customer Questions
No Questions
Please, mind that only logged in users can submit questions
Who Viewed This Also Viewed
CircuitMedic 201-3160 Heat Shield Kit for PCBs
CircuitMedic 201-3160 Heat Shield Kit for PCBs
circuit-medic-201-3160
1
$189.05