CircuitMedic B4-144-1010-080 Flextac BGA Rework Stencil Pack of 10

Circuit Medic B4-144-1010-080 are Flextac BGA rework stencils with a thickness of .004" (0.102 mm), aperture: .017" (0.432 mm), balls: 144, pitch: .0315" (0.80 mm), component: 10 x 10 mm, and sold in a pack of 10.

CircuitMedic stencils are self-sticking solder paste stencils. These laser cut, polymer stencils use a full-release, residue-free adhesive similar to sticky notes. The self-sticking adhesive on the bottom of the stencil seals around each BDA pad to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable CircuitMedic stencils are easy to use and will not leave any reside on the board surface.

The CIR B4-144-1010-080 stencils are better in comparison to metal stencils, as with metal stencils users must fixture or tape them in position in order to hold in place. Additionally, metal stencils can warp, and if the circuit board has undulations in the board surface, the metal stencil will not sit flat. Since there is no gasket-like seal, solder paste can easily bleed under metal stencils when paste is applied with a squeegee. Also solder paste can spill out over the sides of flat stencils contaminating the circuit board surface.

US Patent number: 6,253,675

Related Items for the CIR B4-144-1010-080:

CIR 115-3504: Stainless Steel Squeegee Blade, 12 mm Wide

CIR 115-3506: Stainless Steel Squeegee Blade, 27 mm Wide

CIR 115-3508: Stainless Steel Squeegee Blade, 35 mm Wide

CIR 115-3502: Squeegee Blade Used to Spread Solder Paste