CIR 115-2706

CIR 115-2706
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CircuitMedic 115-2706 Adhesive Bonding Film Circuit Repairs

Part #: CIR 115-2706
MSRP: $16.50 EA
Price: $15.68 EA
Minimum Order Qty: 1
Must be Purchased in Multiples of: 1
Leadtime: Please see availability listed below.
Stock items ship in 24-48 hours.
If stock is not available, CircuitMedic
items ship 7-10 days after receipt of order.


Circuit Medic 115-2706 is a sheet of bonding film that is 1.50" x 2.25" (3.8 x 5.7 cm) in size. It is the same dry adhesive CircuitMedic applies to circuit frames. Additionally this bonding film is used to bond lifted lands, pads, and conductors. Additionally, CIR 115-2706 works exceptionally well when an individually needs to repair both conductors and lifted pads without needing to use messy liquid adhesives. Bonding time for this adhesive is quick, and takes place within 30 seconds. For further specifications regarding this product, please see below.

Specifications of CIR 115-2706:

Overall Size: 2.25" x 1.50" (57 x 38 mm)

Adhesive: Phenolic film adhesive .002" (.051 mm) thick

Bonding Temperature: 475 Degrees F /- 25 Degrees F (246 Degrees C /- 14 Degrees C)

Bonding Time: 30 Seconds

Peel Strength: Minimum 8 pounds per inch (1.43 kg/cm) after cure to FR-4 material

Shelf Life: 1 year minimum. Each Circuit Frame is stamped with the expiration date

REACH: CircuitMedic bonding film contains less than 0.1% by weight any substance listed as a very high concern in Article 59 of REACH

Prices subject to change without notice. Stock can change at any time. Prices are for online orders only. Stock items typically ship in 24-48 hours. Special orders with the manufacturer vary and are subject to their leadtimes.

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