The JBC TT-A is used for soldering tips to re-tin and clean simultaneously.
TT-A Tip Tinner - Cleaner Lead Free
TT_A is a speedy and effective product for cleaning and re-tinning de-wetted soldering irons that cannot be re-tinned by sponges, pads or rosin-cored solder wire.
TT_A is a small block of electronics lead free grade solder power and flux compacted into the shape of a thick disc, applicable for both lead and lead free applications. It is packaged in a metal container complete with lid and self-adhesive pad on the underside so that it can be readily affixed to any convenient surface.
Features and Benefits
-Lead Free
-Rapidly re-tins badly oxidized soldering irons.
-Activators thermally decompose.
-Minimal residues
-Applicable for both lead free & Sn-Pb process.
-Alloy meets international purity standards.
Application Notes
TT-A should be used when soldering iron bits become oxidized and cannot be re-tinned using cored solder wire or solder and flux employed in the normal assembly process.
The Soldering iron should be at normal working temperature and loose debris should be wiped or brushed from the surface. It should then be wiped gently across the surface of the TT-A to produce local melting. There is no need to use a scrubbing action or undue pressure. If the iron is too cool ( under 220 Degrees Celsius), residue inactivation cannot be assured. If the iron is too hot (over 450 Degrees Celsius), re-tinning may be impaired. After re-tinning, the soldering iron bit should be wiped as normal on a damp sponge. It will then be ready for re-use.
TT-A should not be used as a fluxing system for the regular assembly process.
Product Specifications
TT-A Tip Tinner / Cleaner is a mixture including electronic grade solder powder and a unique fluxing system. The flux shows very high activity to clean heavily oxidized metal surfaces such as copper and iron plated soldering iron bits. It is formulated to decompose completely into inert components when exposed briefly to soldering temperatures. Consequently, the residues left after a normal bit re-tinning cycle is compatible with modern No-Clean soldering processes.
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