Kester NXG33 - New Lead-Free No-Clean Solder Paste 600 Gram Cartridge

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Web Price: $116.58

(Minimum order quantity.): 5

Availability: Usually Ships in 2 to 3 Weeks
Manufacturer Part #: 7035050911

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The Kester NXG33 (7035050911) is New Lead-Free No-Clean Solder Paste. This product comes in a 600 Gram Cartridge.

It lead-free, halogen-free no-clean solder paste is the latest state-of-the-art material from Kester. Bringing together halogen-free chemistry, excellent printing, and robust solderability performance, NXG33 is the paste of choice for the modern assembly challenges. Available with a standard Type 4 powder, the NXG33 is capable of a wide range of printing challenges. Backed by Kester’s world renowned customer service, technical service expertise, and 110+ years experience in soldering technology, NXG33 is the only product that satisfies all your assembly needs.

Key Characteristics:

Halogen-Free: The NXG33 is a break-through halogen-free solder paste that is capable of excellent wetting in air reflow. Meets halogen-free definition per IPC requirements of 900ppm Br / 900 ppm Cl / 1500 ppm combined.
Excellent Printability: Truly tremendous printing capability, leading to superior brick definition regardless of idle time, stencil life and print speed. Fully capable of supporting 8x8 mil deposits and other fine feature apertures sizes, including 01005 components. Excellent anti-slump behavior effectively eliminates bridging issues.
Superior Solderability: NXG33 has excellent solderability and boasts best-in-class capability amongst halogen-free materials. Solderability performance promotes anti-graping behavior, even with fine feature printing and air reflow. Fully 01005 capable, even in air reflow. Capable of wide profile flexibility.
Ultra-low BGA Voiding: Low void performance is a must for most assemblies today reducing rework costs and improving first pass yields. NXG33 has ultra-low voiding underneath and even helps lower voiding underneath QFN components.
Clear, Probeable Residues: NXG33 offers light-colored post-soldering residues, even with reflow temperatures at the upper edge of the profile window. NXG33 offers best-in-class residue appearance and penetrability making AOI and manual inspection effortless.

Due to refridgeration requirements, this item must be shipped overnight.

For International Orders (out of the United States) product will be shipped International Priority.

Additional Items of Interest

Kester NXG33 - New Lead-Free No-Clean Solder Paste 500 Gram Jar

Web Price: $97.15
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