The Kester TSF-6592LV is 30 gram Tacky Soldering Flux.
Kester's TSFs are the industry standard for attachment of spheres to BGA and mBGA packages. The TSFs are also used in electronics assembly operations to solder flip chip components to PWB substrates. Kester's TSF portfolio includes a complete line of no clean and water-soluble products capable of being screen and stencil printed, dot dispensed, or thin film transfer processed.
TSF-6592LV Lead-Free No-Clean (For Screen Printing/Stencil Printing/Pin Transfer)
TSF-6592LV is compatible with lead and lead-free solder alloys such as SnAg, SnCu, SnAgCu, SnAgBi, and can be reflowed in nitrogen or air with peaktemperatures up to 270 C. The residues are clear, non-conductive, and non-corrosive.
Available for purchase:
30 gram syringe (#300303)
100 gram jar (#300304)
150 gram cartridge (#300305).
This product must be refrigerated and ship overnight.
(can ship ground to New Jersey, but not warrantied anywhere else that is not a one day ground service from NJ)
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