24-9574-7613

275/66 Diameter .050

RoHS Compliant

K100LD: In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.

"275" No-Clean provides superior wetting performance leaving on extremely clear post-soldering residue. "275" is designed to be a low splattering core flux. "275" is classified as ROL-0 per J-STD-004.