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Home > Soldering Materials > Solder Paste > Tin Lead Solder Paste > No Clean
There are 12 results matching your search criteria:
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Kester 7001020510 is EP256 No-Clean Solder Paste that comes in a 500 Gram Jar. The air or nitrogen re-flowable, solder paste is specifically designed for maximum robustness in re-flow profiling and stencil printing. Kester 7009020510 is FL250D No-Clean Solder Paste in a 500 gram jar. Type 3, 90% Metal Solder paste. Kester 7001020511 is a EP256  No-Clean Solder Paste.  It is air or nitrogen reflowable, specifically designed for maximum robustness in reflow profiling and stencil printing. Kester 7001020310 is EP256, No-Clean Solder Paste is a air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling and stencil printing.

Kester 7013020510 is a R231 No-Clean Solder Paste that comes in a 500 Gram Jar.  Kester R231 is a Mildly Activated Rosin (RMA) solder paste formula specifically designed toexhibit long stencil/print life. R231 maintains itsactivity and printing characteristics for up to 8 hours (temperature and humidity dependent).

Kester 7009020511 is a SN63PB37 (63 percent tin and 37 percent lead) No-Clean, Type 3, 90% Metal Solder Paste that comes in a 600 gram cartridge. Kester 7002020510 is EP256HA No-Clean Solder Paste in a 750 gram cartridge.  This Paste is highly active, air or nitrogen re-flowable paste specifically designed to provide maximum print characteristics and solderability. Kester 7001020519 is an EP256 No-Clean Solder Paste.  It is air or nitrogen reflowable, specifically designed for maximum robustness in reflow profiling and stencil printing.
Kester 7001020311 is a 600 gram jar of EP256 solder paste that is comprised of SN62PB36AG2 or, 62 percent tin, 36 percent lead, and 2 percent silver.  Type 3 powder, 90 percent metal. (Note: Old part number is 57-3203-4813) Kester 7013020511 is a RMA R231, SN63PB37 (or 63 percent tin and 37 percent lead) Solder Paste that comes in a 600 gram cartridge. Kester 7002020511 is EP256HA Highly Active No-Clean Soldering Paste.  It is specifically designed to provide maximum print characteristics and solderability. EP256HA has been designed for applications that require the ultimate activity with respect to difficult to solder to components and board surface metallizations.
Kester 7002020519 EP256HA is a No-Clean Solder Paste (type 3, 90 percent metal), SN63PB37.  It is air or nitrogen reflowable, specifically designed for maximum robustness in reflow profiling and stencil printing.
   
 
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