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Home > Lead Free (RoHS) > Soldering Materials > Lead Free Paste
There are 8 results matching your search criteria:
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Kester 7032130810 is a NXG1 No-Clean Solder Paste that comes in a 500 Gram Jar. Kester 7004030810 is EN828 EnviroMark 828 Water-Soluble Stencil Printing Solder Paste.  It is lead-free paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products. Kester 7006050810 is EM907 EnviroMark lead-free, air and nitrogen reflowable no-clean solder paste specifically designed for the thermal requirements of lead free alloys, including the Sn96.5Ag3.0Cu0.5 alloy.
Kester 7035050910 is NXG33 a New Lead-Free No-Clean Solder Paste. It comes in a 500 Gram Jar. Additionally, it is halogen-free with state-of-the-art capabilities to support modern electronics assembly challenges.
Kester 7032130811 is NXG1 Solder Paste that comes in a 600 Gram Cartridge. Kester 7004030811 is  EnviroMark 828 a lead-free, water-soluble solder paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products.  This product comes in a 600 gram cartridge. Kester 7006050811 is EM907 EnviroMark 907 is a lead-free, air and nitrogen reflowable no-clean solder paste specifically designed for the thermal requirements of lead free alloys, including the Sn96.5Ag3.0Cu0.5 alloy.  This item comes in a 600 gram cartridge.
Kester 7035050911 is NXG33  a New Lead-Free No-Clean Solder Paste.  This product comes in a 600 Gram Cartridge.  Additionally, it is no-clean and halogen free with state-of-the-art capabilities to support modern electronics assembly challenges.
   
 
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