Kester 7001020510 is EP256 No-Clean Solder Paste that comes in a 500 Gram Jar. The air or nitrogen re-flowable, solder paste is specifically designed for maximum robustness in re-flow profiling and stencil printing.
Kester 256 no-clean solder paste is designed for maximum robustness in reflow profiling and printing. Contains the widest possible reflow processing window. Capable of printing downtimes of up to 90 minutes with an effective first print down to 20 mils. Maintains its activity and printing characteristics for up to 8 hours without any shear thinning. Compatible with enclosed print head systems.
Kester EP256 No-Clean, Type 3, 90% Metal Solder Paste Sn63Pb37 500 Gram Jar (Old #57-3201- 4809 New #7001020510)
Please note: This item must be shipped overnight.
For International Orders (out of the United States) product will be shipped International Priority.