Kester 959T is non-corrosive and halide free that is specifically designed for lead-free rework of conventional and surface mount circuit board assemblies. Essentially no residue remains after soldering.
Kester 959T was developed with a modified surface tension to aid in soldering boards that have surface mount and high component densities. This comprehensive formulation possesses improved wetting characteristics and also exhibits superior corrosion inhibiting properties and provides a non-tacky residue. A major advantage of this flux is the reduced odor associated with the soldering profess. Kester 959T incorporates a small amount of rosin for higher reliability.
Performance Characteristics:
Residues almost colorless
Improves soldering performance
Reduced odor associated with soldering process
Eliminates the need and expense of cleaning
Non-corrosive tack-free residues
Contains < 0.5% Rosin
Classified as ORL0 per J-STD-004
Compliant to Bellcore GR-78
RoHS Compliance: This product meets the requirements of the RoHS (Restriction of Hazardous Substances) Directive, 2002/95/EC Article 4 for the stated banned substances.
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