Kester 275 No-Clean flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of 275 no-clean flux results in an extremely clear post-soldering residue without cleaning. The unique chemistry in Kester 275 was also designed to reduce spattering common to most core fluxes. Kester 275 can be used for both lead bearing and lead-free soldering.
Performance Characteristics:
Colorless translucent residues
Improves wetting performance
Excellent solderability and fast wetting to a variety of surface finishes
Eliminates the need and expense of cleaning
Low smoke and odor
Low spattering
Compatible with leaded and lead-free alloys
Classified as ROL0 per J-STD-004
Compliant to Bellcore GR-78
RoHS Compliance:
This product meets the requirements of the RoHS (Restriction of Hazardous Substances) Directive, 2002/95/EC Article 4 for the stated banned substances. (Applies only if this core flux is combined with a lead free alloy)
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