Kester 300303 TSF-6592LV Tacky No Clean Paste Soldering Flux 30 gram Syringe
Special Order
SKU
kester-300303
$48.50
Kester 300303 TSF-6592LV is 30 gram No-Clean, Tacky Soldering Flux Paste. (Considered Kester Semiconductor Materials)
Minimum Order Qty: 1
Inventory: 0
Lead time: Inventory listed above; Ships in 24-48 hours.
Otherwise, usually ships in 3-4 weeks.
Otherwise, usually ships in 3-4 weeks.
Kester 300303 TSF-6592LV is 30 gram No-Clean, Tacky Soldering Flux Paste. (Considered Kester Semiconductor Materials)
Kester TSF-6592LV is a No Clean Paste Flux designed as a Lead Free Solution for an array of Lead Free interconnected applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any Lead Free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications.
Performance Characteristics:Compatible with Lead Free alloys such as SNAG, SNCU, SNAGCU, and SNAGBIReflow-able in air and nitrogenBright shiny soldered joints with clear residuesAggressive flux on various substrates such as OSP-CU, Immersion finishes and ENIGClear non-tacky residuesHigh tack to minimize skewing of componentsLow voidingStencil Life of 8 hours (process dependent)Classified as ROL0 per J-STD-004Compliant to Bellcore GR-78
RoHS Compliance:This product meets the requirements of the RoHS (Restriction of Hazardous Substances) Directive, 2002/95/EC Article 4 for the stated banned Substances.
This product must be refrigerated and ships overnight.
(Can ship ground to New Jersey, but not warrantied anywhere else that is not a one day ground service from NJ)
Kester TSF-6592LV is a No Clean Paste Flux designed as a Lead Free Solution for an array of Lead Free interconnected applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any Lead Free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications.
Performance Characteristics:Compatible with Lead Free alloys such as SNAG, SNCU, SNAGCU, and SNAGBIReflow-able in air and nitrogenBright shiny soldered joints with clear residuesAggressive flux on various substrates such as OSP-CU, Immersion finishes and ENIGClear non-tacky residuesHigh tack to minimize skewing of componentsLow voidingStencil Life of 8 hours (process dependent)Classified as ROL0 per J-STD-004Compliant to Bellcore GR-78
RoHS Compliance:This product meets the requirements of the RoHS (Restriction of Hazardous Substances) Directive, 2002/95/EC Article 4 for the stated banned Substances.
This product must be refrigerated and ships overnight.
(Can ship ground to New Jersey, but not warrantied anywhere else that is not a one day ground service from NJ)
| California Proposition 65 | Not applicable |
|---|---|
| Discontinued | No |
| Brand | Kester Solder |
| Manufacturer | Kester Solder |
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