Special Order
SKU
kester-24-7068-7601
$80.22
Kester 24-7068-7601 is a 1 lb spool of lead-free, no-clean, flux-cored solder wire with a diameter of .031 inches. It is comprised of SN96.5AG3CU.5, or 96.5 percent tin, 3 percent silver, and .5 percent copper. Additionally, it has a 58 core size and a 275 (no-clean) flux type.
Minimum Order Qty: 1
Inventory: 0
Lead time: Inventory listed above; Ships in 24-48 hours.
Otherwise, usually ships in 3-4 weeks.
Otherwise, usually ships in 3-4 weeks.
Kester 24-7068-7601 is a 1 lb spool of lead-free, no-clean, flux-cored solder wire with a diameter of .031 inches. It is comprised of SN96.5AG3CU.5, or 96.5 percent tin, 3 percent silver, and .5 percent copper. Additionally, it has a 58 core size and a 275 (no-clean) flux type.
Kester 275 No-Clean flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of 275 no-clean flux results in an extremely clear post-soldering residue without cleaning. The unique chemistry in Kester 275 was also designed to reduce spattering common to most core fluxes. Kester 275 can be used for both lead bearing and lead-free soldering.
Performance Characteristics:Colorless translucent residuesImproves wetting performanceExcellent solderability and fast wetting to a variety of surface finishesEliminates the need and expense of cleaningLow smoke and odorLow spatteringCompatible with leaded and lead-free alloysClassified as ROL0 per J-STD-004Compliant to Bellcore GR-78
RoHS Compliance:This product meets the requirements of the RoHS (Restriction of Hazardous Substances) Directive, 2002/95/EC Article 4 for the stated banned substances. (Applies only if this core flux is combined with a lead free alloy)
Kester 275 No-Clean flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of 275 no-clean flux results in an extremely clear post-soldering residue without cleaning. The unique chemistry in Kester 275 was also designed to reduce spattering common to most core fluxes. Kester 275 can be used for both lead bearing and lead-free soldering.
Performance Characteristics:Colorless translucent residuesImproves wetting performanceExcellent solderability and fast wetting to a variety of surface finishesEliminates the need and expense of cleaningLow smoke and odorLow spatteringCompatible with leaded and lead-free alloysClassified as ROL0 per J-STD-004Compliant to Bellcore GR-78
RoHS Compliance:This product meets the requirements of the RoHS (Restriction of Hazardous Substances) Directive, 2002/95/EC Article 4 for the stated banned substances. (Applies only if this core flux is combined with a lead free alloy)
California Proposition 65 | Not applicable |
---|---|
Discontinued | No |
Brand | Kester Solder |
Manufacturer | Kester Solder |
Alloy | Copper (CU), Silver (AG), Tin (SN) |
Lead Content | Lead Free (RoHS) |
Halogen Content | Contains Halogen |
Spool Size | 1 lb |
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