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  Home > Kester Brand >

  Kester 300303 - TSF-6592LV Tacky No Clean Paste Soldering Flux 30 gram Syringe

Kester 300303 No CleanTacky Solder Flux Paste
Kester Solder

Authorized Distributor

In stock items ship in 24-48 hours!
Otherwise, on order with the manufacturer
and will ship in approximately 3-4 weeks.

Price: $35.95
Minimum order must be purchased in multiples:   10

Quantity available:30
Part #: KESTER-300303

Product Description
Kester 300303 TSF-6592LV is 30 gram No-Clean, Tacky Soldering Flux Paste.   (Considered Kester Semiconductor Materials)

Kester TSF-6592LV is a No Clean Paste Flux designed as a Lead Free Solution for an array of Lead Free interconnected applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any Lead Free soldering application that requires a very tacky flux.  It has been optimized for consistent high speed printing applications.

Performance Characteristics:
Compatible with Lead Free alloys such as SNAG, SNCU, SNAGCU, and SNAGBI
Reflow-able in air and nitrogen
Bright shiny soldered joints with clear reidues
Aggressive flux on various substrates such as OSP-CU, Immersion finishes and ENIG
Clear non-tacky residues
High tack to minimize skewing of components
Low voiding
Stencil Life of 8+ hours (process dependent)
Classified as ROL0 per J-STD-004
Compliant to Bellcore GR-78

RoHS Compliance:
This product meets the requirements of the RoHS (Restriction of Hazardous Substances) Directive, 2002/95/EC Article 4 for the stated banned Substances.

This product must be refrigerated and ships overnight.
(Can ship ground to New Jersey, but not warrantied anywhere else that is not a one day ground service from NJ)

Prices subject to change without notice. Stock can change at any time. Prices are for online orders only.

Kester Brand
Soldering Materials > Tacky Solder Paste Flux > Lead Free Tacky Solder Paste
Soldering Materials > Tacky Solder Paste Flux
Soldering Materials