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DESCO 12780 BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 4INx6IN,100 EA/PK
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DESCO 12781 BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 5INx8IN, 100 EA/PK
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DESCO 12782 BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 6INx10IN ,100 EA/PK
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DESCO 12783 BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 8INx10IN, 100 EA/PK
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MFG List Price: $5.16
Your Price: $4.13
Savings: $1.03!
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MFG List Price: $8.18
Your Price: $6.57
Savings: $1.61!
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MFG List Price: $9.86
Your Price: $7.92
Savings: $1.94!
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MFG List Price: $14.08
Your Price: $11.30
Savings: $2.78!
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BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 4INx6IN,100 EA/PK
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BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 5INx8IN, 100 EA/PK
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BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 6INx10IN ,100 EA/PK
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BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 8INx10IN, 100 EA/PK
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DESCO 12784 BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 8INx12IN, 100 EA/PK
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DESCO 12785 BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 10INx12IN, 100EA/PK
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DESCO 12786 BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 10INx14IN, 100EA/PK
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Kester K100LD (Tin/Copper/Nickel) 48/66 Activated Rosin Cored Wire Solder Dia. .062 ROHS (24-9574-1400)
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MFG List Price: $16.26
Your Price: $13.05
Savings: $3.21!
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MFG List Price: $18.78
Your Price: $15.08
Savings: $3.70!
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MFG List Price: $22.37
Your Price: $17.95
Savings: $4.42!
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MFG List Price: $28.95
Your Price: $23.95
Savings: $5.00!
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BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 8INx12IN, 100 EA/PK
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BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 10INx12IN, 100EA/PK
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BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 10INx14IN, 100EA/PK
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24-9574-140048/66 Diameter .062 RoHS Compliant K100LD: In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable soldering of most common metals. Kester 48 has performance characteristics far exceeding standard RA fluxes. Kester 48 builds on the performance of its predecessor Kester 44 with instant-action wetting to provide fast and reliable solder joints.
Kester K100LD Lead-Free Wire Solder
Diminish the 5D's
Dissolution. Dullness.
Defects. Dross.
Dollars.
K100LD
LEAD-FREE ROHS Compliant Solder
K100LD is a new patent-pending low-cost lead-free solder alloy for use in wave soldering, selective soldering and tip tinning operations. K100LD has the Lowest Copper Dissolution amongst all common solder alloys, including SN63, SAC305, and other lead-free options. Kester K100LD provides the lowest cost for wave soldering operations. It also provides solder joints with no shrinkage effects, excellent through-hole penetration, topside fillet, and provides a low dross rate.
Each wire spool weighs 1 lb.
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DESCO 12792 BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 12INx16IN,100 EA/PK
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Kester K100LD (Tin/Copper/Bismuth) 48/66 Activated Rosin Cored Wire Solder Dia. .050 ROHS (24-9574-1404)
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Kester K100LD (Tin/Copper/Bismuth) 331/66 Water Soluble Cored Wire Solder Dia. .050 ROHS (24-9574-6409)
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Kester K100LD (Tin/Copper/Bismuth) 331/66 Water Soluble Cored Wire Solder Dia. .062 ROHS (24-9574-6411)
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MFG List Price: $29.84
Your Price: $23.96
Savings: $5.88!
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MFG List Price: $32.95
Your Price: $26.95
Savings: $6.00!
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MFG List Price: $32.95
Your Price: $26.95
Savings: $6.00!
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MFG List Price: $32.95
Your Price: $26.95
Savings: $6.00!
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BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 12INx16IN,100 EA/PK
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24-9574-140448/66 Diameter .050 RoHS Compliant K100LD: In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable soldering of most common metals. Kester 48 has performance characteristics far exceeding standard RA fluxes. Kester 48 builds on the performance of its predecessor Kester 44 with instant-action wetting to provide fast and reliable solder joints.
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24-9574-6409331/66 Diameter .050 RoHS Compliant K100LD: In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives."331" is a high-activity water-soluble core flux for soldering difficult metals. "331" is designed for optimal cleanability, along with minimal smoke and odor. The residues from "331" must be removed. "331" is classified as 0RH1 per J-STD-004.
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24-9574-6411331/66 Diameter .062 RoHS Compliant K100LD: In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives."331" is a high-activity water-soluble core flux for soldering difficult metals. "331" is designed for optimal cleanability, along with minimal smoke and odor. The residues from "331" must be removed. "331" is classified as 0RH1 per J-STD-004.
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Kester K100LD (Tin/Copper/Bismuth) 275/66 No-Clean Cored Wire Solder Dia. .050 ROHS (24-9574-7613)
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Kester K100LD (Tin/Copper/Bismuth) 275/66 No-Clean Cored Wire Solder Dia. .062 ROHS (24-9574-7615)
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DESCO 12788 BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 12INx18IN, 100EA/PK
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Kester K100LD (Tin/Copper/Bismuth) 48/66 Activated Rosin Cored Wire Solder Dia. .031 ROHS (24-9574-1402)
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MFG List Price: $32.95
Your Price: $26.95
Savings: $6.00!
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MFG List Price: $32.95
Your Price: $26.95
Savings: $6.00!
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MFG List Price: $34.35
Your Price: $27.57
Savings: $6.78!
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MFG List Price: $36.95
Your Price: $29.95
Savings: $7.00!
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24-9574-7609275/66 Diameter .050 RoHS Compliant K100LD: In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives."275" No-Clean provides superior wetting performance leaving on extremely clear post-soldering residue. "275" is designed to be a low splattering core flux. "275" is classified as ROL-0 per J-STD-004.
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24-9574-7609275/66 Diameter .062 RoHS Compliant K100LD: In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives."275" No-Clean provides superior wetting performance leaving on extremely clear post-soldering residue. "275" is designed to be a low splattering core flux. "275" is classified as ROL-0 per J-STD-004.
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BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 12INx18IN, 100EA/PK
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24-9574-140248/66 Diameter .031 RoHS Compliant K100LD: In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable soldering of most common metals. Kester 48 has performance characteristics far exceeding standard RA fluxes. Kester 48 builds on the performance of its predecessor Kester 44 with instant-action wetting to provide fast and reliable solder joints.
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Kester K100LD (Tin/Copper/Bismuth) 331/66 Water Soluble Cored Wire Solder Dia. .031 ROHS (24-9574-6403)
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Kester K100LD (Tin/Copper/Bismuth) 275/66 No-Clean Cored Wire Solder Dia. .031 ROHS (24-9574-7618)
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Kester K100LD (Tin/Copper/Bismuth) 48/66 Activated Rosin Cored Wire Solder Dia. .025 ROHS (24-9574-1406)
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Kester K100LD (Tin/Copper/Bismuth) 331/66 Water Soluble Cored Wire Solder Dia. .025 ROHS (24-9574-6417)
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MFG List Price: $36.95
Your Price: $29.95
Savings: $7.00!
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MFG List Price: $36.95
Your Price: $29.95
Savings: $7.00!
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MFG List Price: $37.95
Your Price: $30.95
Savings: $7.00!
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MFG List Price: $37.95
Your Price: $30.95
Savings: $7.00!
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24-9574-6403331/66 Diameter .031 RoHS Compliant K100LD: In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives."331" is a high-activity water-soluble core flux for soldering difficult metals. "331" is designed for optimal cleanability, along with minimal smoke and odor. The residues from "331" must be removed. "331" is classified as 0RH1 per J-STD-004.
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24-9574-7609275/66 Diameter .031 RoHS Compliant K100LD: In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives."275" No-Clean provides superior wetting performance leaving on extremely clear post-soldering residue. "275" is designed to be a low splattering core flux. "275" is classified as ROL-0 per J-STD-004.
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24-9574-140648/66 Diameter .025 RoHS Compliant K100LD: In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable soldering of most common metals. Kester 48 has performance characteristics far exceeding standard RA fluxes. Kester 48 builds on the performance of its predecessor Kester 44 with instant-action wetting to provide fast and reliable solder joints.
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24-9574-6417331/66 Diameter .025 RoHS Compliant K100LD: In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives."331" is a high-activity water-soluble core flux for soldering difficult metals. "331" is designed for optimal cleanability, along with minimal smoke and odor. The residues from "331" must be removed. "331" is classified as 0RH1 per J-STD-004.
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Kester K100LD (Tin/Copper/Bismuth) 275/66 No-Clean Cored Wire Solder Dia. .025 ROHS (24-9574-7619)
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DESCO 12787 BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 10INx24IN, 100EA/PK
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DESCO 12789 BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 15INx18IN, 100EA/PK
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Kester K100LD (Tin/Copper/Bismuth) 48/66 Activated Rosin Cored Wire Solder Dia. .020 ROHS (24-9574-1401)
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MFG List Price: $37.95
Your Price: $30.95
Savings: $7.00!
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MFG List Price: $39.97
Your Price: $32.08
Savings: $7.89!
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MFG List Price: $43.98
Your Price: $35.31
Savings: $8.67!
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MFG List Price: $45.95
Your Price: $36.95
Savings: $9.00!
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24-9574-7609275/66 Diameter .025 RoHS Compliant K100LD: In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives."275" No-Clean provides superior wetting performance leaving on extremely clear post-soldering residue. "275" is designed to be a low splattering core flux. "275" is classified as ROL-0 per J-STD-004.
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BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 10INx24IN, 100EA/PK
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BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 15INx18IN, 100EA/PK
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24-9574-140148/66 Diameter .020 RoHS Compliant K100LD: In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable soldering of most common metals. Kester 48 has performance characteristics far exceeding standard RA fluxes. Kester 48 builds on the performance of its predecessor Kester 44 with instant-action wetting to provide fast and reliable solder joints.
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Kester K100LD (Tin/Copper/Bismuth) 331/66 Water Soluble Cored Wire Solder Dia. .020 ROHS (24-9574-6401)
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Kester K100LD (Tin/Copper/Bismuth) 275/66 No-Clean Cored Wire Solder Dia. .020 ROHS (24-9574-7610)
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Kester SN96.5 AG3.0 CU0.5 275/58 SAC305 No-Clean Cored Wire Solder Dia. .062 ROHS (24-7068-7607)
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DESCO 12790 BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 18INx18IN, 100EA/PK
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MFG List Price: $45.95
Your Price: $36.95
Savings: $9.00!
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MFG List Price: $45.95
Your Price: $36.95
Savings: $9.00!
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MFG List Price: $49.95
Your Price: $40.95
Savings: $9.00!
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MFG List Price: $51.13
Your Price: $41.04
Savings: $10.09!
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24-9574-6401331/66 Diameter .020 RoHS Compliant K100LD: In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives."331" is a high-activity water-soluble core flux for soldering difficult metals. "331" is designed for optimal cleanability, along with minimal smoke and odor. The residues from "331" must be removed. "331" is classified as 0RH1 per J-STD-004.
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24-9574-7609275/66 Diameter .020 RoHS Compliant K100LD: In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives."275" No-Clean provides superior wetting performance leaving on extremely clear post-soldering residue. "275" is designed to be a low splattering core flux. "275" is classified as ROL-0 per J-STD-004.
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24-7068-7607SAC305 275/58 Diameter .062 RoHS Compliant SAC305:
Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the user to get the most value for the money with minimal maintenance costs. Kester Ultrapure SAC305 Bar Solder was designed to minimize the amount of dross generated in a wave soldering, selective soldering or dip soldering process. Kester Ultrapure SAC305 is manufactured with virgin metals which meet the high standards of Kester Ultrapure line of bar solders.
When molten solder comes in contact with air, it forms metal oxides or dross. This dross mixes in with the solder in the upper layer of solder in the solder pot to form a pasty solder dross mixture. Many solder impurities have been known to contribute to dross formation - aluminum, cadmium, iron and zinc are the most common of these. The purity level of Kester Ultrapure SAC305 exceeds the industry requirements for allowable impurity levels, which helps control dross levels. Aside from exceptional control on solder purity, the Kester Ultrapure SAC305 manufacturing process integrates a low dross additive to minimize dross formation during the soldering process. Additionally, Kester employs an extrusion manufacturing technique to minimize oxidation and alloy segregation during the manufacturing process. Old-fashioned methods of casting individual bars lacks protection from the atmosphere in the molten state and exposes more surface area which produces correspondingly more oxide.
Kester Ultrapure SAC305 yields less dross, bright solder joints, and a reduction in defects in wave, selective and dip soldering processes."275" No-Clean provides superior wetting performance leaving an extremely clear post-soldering residue. "275" is designed to be a low splattering core flux. "275" is classified as ROL-0 per J-STD-004.
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BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 18INx18IN, 100EA/PK
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Kester SN96.5 AG3.0 CU0.5 48/66 SAC305 Activated Rosin Cored Wire Solder Dia. .062 ROHS (24-7068-1400
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Kester SN96.5 AG3.0 CU0.5 331/66 SAC305 Water-Soluble Cored Wire Solder Dia. .062 ROHS (24-7068-6411)
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Kester K100LD (Tin/Copper/Bismuth) 331/66 Water Soluble Cored Wire Solder Dia. .015 ROHS (24-9574-6422)
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Kester K100LD (Tin/Copper/Bismuth) 275/66 No-Clean Cored Wire Solder Dia. .015 ROHS (24-9574-7609)
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MFG List Price: $51.95
Your Price: $41.95
Savings: $10.00!
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MFG List Price: $51.95
Your Price: $41.95
Savings: $10.00!
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MFG List Price: $51.95
Your Price: $41.95
Savings: $10.00!
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MFG List Price: $51.95
Your Price: $41.95
Savings: $10.00!
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24-7068-1400SAC305 48/66 Diameter .062 RoHS Compliant SAC305:
Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the user to get the most value for the money with minimal maintenance costs. Kester Ultrapure SAC305 Bar Solder was designed to minimize the amount of dross generated in a wave soldering, selective soldering or dip soldering process. Kester Ultrapure SAC305 is manufactured with virgin metals which meet the high standards of Kester Ultrapure line of bar solders.
When molten solder comes in contact with air, it forms metal oxides or dross. This dross mixes in with the solder in the upper layer of solder in the solder pot to form a pasty solder dross mixture. Many solder impurities have been known to contribute to dross formation - aluminum, cadmium, iron and zinc are the most common of these. The purity level of Kester Ultrapure SAC305 exceeds the industry requirements for allowable impurity levels, which helps control dross levels. Aside from exceptional control on solder purity, the Kester Ultrapure SAC305 manufacturing process integrates a low dross additive to minimize dross formation during the soldering process. Additionally, Kester employs an extrusion manufacturing technique to minimize oxidation and alloy segregation during the manufacturing process. Old-fashioned methods of casting individual bars lacks protection from the atmosphere in the molten state and exposes more surface area which produces correspondingly more oxide.
Kester Ultrapure SAC305 yields less dross, bright solder joints, and a reduction in defects in wave, selective and dip soldering processes.Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable soldering of most common metals. Kester 48 has performance characteristics far exceeding standard RA fluxes. Kester 48 builds on the performance of its predecessor Kester 44 with ?instant-action? wetting to provide fast and reliable solder joints.
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24-7068-6411SAC305 331/66 Diameter .062 RoHS Compliant SAC305:
Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the user to get the most value for the money with minimal maintenance costs. Kester Ultrapure SAC305 Bar Solder was designed to minimize the amount of dross generated in a wave soldering, selective soldering or dip soldering process. Kester Ultrapure SAC305 is manufactured with virgin metals which meet the high standards of Kester Ultrapure line of bar solders.
When molten solder comes in contact with air, it forms metal oxides or dross. This dross mixes in with the solder in the upper layer of solder in the solder pot to form a pasty solder dross mixture. Many solder impurities have been known to contribute to dross formation - aluminum, cadmium, iron and zinc are the most common of these. The purity level of Kester Ultrapure SAC305 exceeds the industry requirements for allowable impurity levels, which helps control dross levels. Aside from exceptional control on solder purity, the Kester Ultrapure SAC305 manufacturing process integrates a low dross additive to minimize dross formation during the soldering process. Additionally, Kester employs an extrusion manufacturing technique to minimize oxidation and alloy segregation during the manufacturing process. Old-fashioned methods of casting individual bars lacks protection from the atmosphere in the molten state and exposes more surface area which produces correspondingly more oxide.
Kester Ultrapure SAC305 yields less dross, bright solder joints, and a reduction in defects in wave, selective and dip soldering processes."331" is a high-activity water-soluble core flux for soldering difficult metals. "331" is designed for optimal cleanability, along with minimal smoke and odor. The residues from "331" must be removed. "331" is classified as 0RH1 per J-STD-004.
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24-9574-6422331/66 Diameter .015 RoHS Compliant K100LD: In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives."331" is a high-activity water-soluble core flux for soldering difficult metals. "331" is designed for optimal cleanability, along with minimal smoke and odor. The residues from "331" must be removed. "331" is classified as 0RH1 per J-STD-004.
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24-9574-7609275/66 Diameter .015 RoHS Compliant K100LD: In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives."275" No-Clean provides superior wetting performance leaving on extremely clear post-soldering residue. "275" is designed to be a low splattering core flux. "275" is classified as ROL-0 per J-STD-004.
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Kester SN96.5 AG3.0 CU0.5 48/66 SAC305 Activated Rosin Cored Wire Solder Dia. .050 ROHS (24-7068-1404
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Kester SN96.5 AG3.0 CU0.5 331/66 SAC305 Water-Soluble Cored Wire Solder Dia. .050 ROHS (24-7068-6409)
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Kester SN96.5 AG3.0 CU0.5 275/58 SAC305 No-Clean Cored Wire Solder Dia. .050 ROHS (24-7068-7606)
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Kester SN96.5 AG3.0 CU0.5 48/66 SAC305 Activated Rosin Cored Wire Solder Dia. .031 ROHS (24-7068-1402
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MFG List Price: $52.95
Your Price: $42.95
Savings: $10.00!
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MFG List Price: $52.95
Your Price: $42.95
Savings: $10.00!
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MFG List Price: $52.95
Your Price: $42.95
Savings: $10.00!
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MFG List Price: $55.95
Your Price: $44.95
Savings: $11.00!
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24-7068-1404SAC305 48/66 Diameter .050 RoHS Compliant SAC305:
Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the user to get the most value for the money with minimal maintenance costs. Kester Ultrapure SAC305 Bar Solder was designed to minimize the amount of dross generated in a wave soldering, selective soldering or dip soldering process. Kester Ultrapure SAC305 is manufactured with virgin metals which meet the high standards of Kester Ultrapure line of bar solders.
When molten solder comes in contact with air, it forms metal oxides or dross. This dross mixes in with the solder in the upper layer of solder in the solder pot to form a pasty solder dross mixture. Many solder impurities have been known to contribute to dross formation - aluminum, cadmium, iron and zinc are the most common of these. The purity level of Kester Ultrapure SAC305 exceeds the industry requirements for allowable impurity levels, which helps control dross levels. Aside from exceptional control on solder purity, the Kester Ultrapure SAC305 manufacturing process integrates a low dross additive to minimize dross formation during the soldering process. Additionally, Kester employs an extrusion manufacturing technique to minimize oxidation and alloy segregation during the manufacturing process. Old-fashioned methods of casting individual bars lacks protection from the atmosphere in the molten state and exposes more surface area which produces correspondingly more oxide.
Kester Ultrapure SAC305 yields less dross, bright solder joints, and a reduction in defects in wave, selective and dip soldering processes.Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable soldering of most common metals. Kester 48 has performance characteristics far exceeding standard RA fluxes. Kester 48 builds on the performance of its predecessor Kester 44 with ?instant-action? wetting to provide fast and reliable solder joints.
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24-7068-6409SAC305 331/66 Diameter .050 RoHS Compliant SAC305:
Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the user to get the most value for the money with minimal maintenance costs. Kester Ultrapure SAC305 Bar Solder was designed to minimize the amount of dross generated in a wave soldering, selective soldering or dip soldering process. Kester Ultrapure SAC305 is manufactured with virgin metals which meet the high standards of Kester Ultrapure line of bar solders.
When molten solder comes in contact with air, it forms metal oxides or dross. This dross mixes in with the solder in the upper layer of solder in the solder pot to form a pasty solder dross mixture. Many solder impurities have been known to contribute to dross formation - aluminum, cadmium, iron and zinc are the most common of these. The purity level of Kester Ultrapure SAC305 exceeds the industry requirements for allowable impurity levels, which helps control dross levels. Aside from exceptional control on solder purity, the Kester Ultrapure SAC305 manufacturing process integrates a low dross additive to minimize dross formation during the soldering process. Additionally, Kester employs an extrusion manufacturing technique to minimize oxidation and alloy segregation during the manufacturing process. Old-fashioned methods of casting individual bars lacks protection from the atmosphere in the molten state and exposes more surface area which produces correspondingly more oxide.
Kester Ultrapure SAC305 yields less dross, bright solder joints, and a reduction in defects in wave, selective and dip soldering processes."331" is a high-activity water-soluble core flux for soldering difficult metals. "331" is designed for optimal cleanability, along with minimal smoke and odor. The residues from "331" must be removed. "331" is classified as 0RH1 per J-STD-004.
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24-7068-7606SAC305 275/58 Diameter .050 RoHS Compliant SAC305:
Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the user to get the most value for the money with minimal maintenance costs. Kester Ultrapure SAC305 Bar Solder was designed to minimize the amount of dross generated in a wave soldering, selective soldering or dip soldering process. Kester Ultrapure SAC305 is manufactured with virgin metals which meet the high standards of Kester Ultrapure line of bar solders.
When molten solder comes in contact with air, it forms metal oxides or dross. This dross mixes in with the solder in the upper layer of solder in the solder pot to form a pasty solder dross mixture. Many solder impurities have been known to contribute to dross formation - aluminum, cadmium, iron and zinc are the most common of these. The purity level of Kester Ultrapure SAC305 exceeds the industry requirements for allowable impurity levels, which helps control dross levels. Aside from exceptional control on solder purity, the Kester Ultrapure SAC305 manufacturing process integrates a low dross additive to minimize dross formation during the soldering process. Additionally, Kester employs an extrusion manufacturing technique to minimize oxidation and alloy segregation during the manufacturing process. Old-fashioned methods of casting individual bars lacks protection from the atmosphere in the molten state and exposes more surface area which produces correspondingly more oxide.
Kester Ultrapure SAC305 yields less dross, bright solder joints, and a reduction in defects in wave, selective and dip soldering processes."275" No-Clean provides superior wetting performance leaving an extremely clear post-soldering residue. "275" is designed to be a low splattering core flux. "275" is classified as ROL-0 per J-STD-004.
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24-7068-1402SAC305 48/66 Diameter .031 RoHS Compliant SAC305:
Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the user to get the most value for the money with minimal maintenance costs. Kester Ultrapure SAC305 Bar Solder was designed to minimize the amount of dross generated in a wave soldering, selective soldering or dip soldering process. Kester Ultrapure SAC305 is manufactured with virgin metals which meet the high standards of Kester Ultrapure line of bar solders.
When molten solder comes in contact with air, it forms metal oxides or dross. This dross mixes in with the solder in the upper layer of solder in the solder pot to form a pasty solder dross mixture. Many solder impurities have been known to contribute to dross formation - aluminum, cadmium, iron and zinc are the most common of these. The purity level of Kester Ultrapure SAC305 exceeds the industry requirements for allowable impurity levels, which helps control dross levels. Aside from exceptional control on solder purity, the Kester Ultrapure SAC305 manufacturing process integrates a low dross additive to minimize dross formation during the soldering process. Additionally, Kester employs an extrusion manufacturing technique to minimize oxidation and alloy segregation during the manufacturing process. Old-fashioned methods of casting individual bars lacks protection from the atmosphere in the molten state and exposes more surface area which produces correspondingly more oxide.
Kester Ultrapure SAC305 yields less dross, bright solder joints, and a reduction in defects in wave, selective and dip soldering processes.Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable soldering of most common metals. Kester 48 has performance characteristics far exceeding standard RA fluxes. Kester 48 builds on the performance of its predecessor Kester 44 with ?instant-action? wetting to provide fast and reliable solder joints.
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Kester SN96.5 AG3.0 CU0.5 331/66 SAC305 Water-Soluble Cored Wire Solder Dia. .031 ROHS (24-7068-6403)
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Kester SN96.5 AG3.0 CU0.5 275/58 SAC305 No-Clean Cored Wire Solder Dia. .031 ROHS (24-7068-7601)
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Kester SN96.5 AG3.0 CU0.5 48/66 SAC305 Activated Rosin Cored Wire Solder Dia. .025 ROHS (24-7068-1406
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Kester SN96.5 AG3.0 CU0.5 275/58 SAC305 No-Clean Cored Wire Solder Dia. .025 ROHS (24-7068-7617)
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MFG List Price: $55.95
Your Price: $44.95
Savings: $11.00!
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MFG List Price: $55.95
Your Price: $44.95
Savings: $11.00!
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MFG List Price: $56.95
Your Price: $45.95
Savings: $11.00!
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MFG List Price: $56.95
Your Price: $45.95
Savings: $11.00!
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24-7068-6403SAC305 331/66 Diameter .031 RoHS Compliant SAC305:
Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the user to get the most value for the money with minimal maintenance costs. Kester Ultrapure SAC305 Bar Solder was designed to minimize the amount of dross generated in a wave soldering, selective soldering or dip soldering process. Kester Ultrapure SAC305 is manufactured with virgin metals which meet the high standards of Kester Ultrapure line of bar solders.
When molten solder comes in contact with air, it forms metal oxides or dross. This dross mixes in with the solder in the upper layer of solder in the solder pot to form a pasty solder dross mixture. Many solder impurities have been known to contribute to dross formation - aluminum, cadmium, iron and zinc are the most common of these. The purity level of Kester Ultrapure SAC305 exceeds the industry requirements for allowable impurity levels, which helps control dross levels. Aside from exceptional control on solder purity, the Kester Ultrapure SAC305 manufacturing process integrates a low dross additive to minimize dross formation during the soldering process. Additionally, Kester employs an extrusion manufacturing technique to minimize oxidation and alloy segregation during the manufacturing process. Old-fashioned methods of casting individual bars lacks protection from the atmosphere in the molten state and exposes more surface area which produces correspondingly more oxide.
Kester Ultrapure SAC305 yields less dross, bright solder joints, and a reduction in defects in wave, selective and dip soldering processes."331" is a high-activity water-soluble core flux for soldering difficult metals. "331" is designed for optimal cleanability, along with minimal smoke and odor. The residues from "331" must be removed. "331" is classified as 0RH1 per J-STD-004.
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24-7068-7601SAC305 275/58 Diameter .031 RoHS Compliant SAC305:
Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the user to get the most value for the money with minimal maintenance costs. Kester Ultrapure SAC305 Bar Solder was designed to minimize the amount of dross generated in a wave soldering, selective soldering or dip soldering process. Kester Ultrapure SAC305 is manufactured with virgin metals which meet the high standards of Kester Ultrapure line of bar solders.
When molten solder comes in contact with air, it forms metal oxides or dross. This dross mixes in with the solder in the upper layer of solder in the solder pot to form a pasty solder dross mixture. Many solder impurities have been known to contribute to dross formation - aluminum, cadmium, iron and zinc are the most common of these. The purity level of Kester Ultrapure SAC305 exceeds the industry requirements for allowable impurity levels, which helps control dross levels. Aside from exceptional control on solder purity, the Kester Ultrapure SAC305 manufacturing process integrates a low dross additive to minimize dross formation during the soldering process. Additionally, Kester employs an extrusion manufacturing technique to minimize oxidation and alloy segregation during the manufacturing process. Old-fashioned methods of casting individual bars lacks protection from the atmosphere in the molten state and exposes more surface area which produces correspondingly more oxide.
Kester Ultrapure SAC305 yields less dross, bright solder joints, and a reduction in defects in wave, selective and dip soldering processes."275" No-Clean provides superior wetting performance leaving an extremely clear post-soldering residue. "275" is designed to be a low splattering core flux. "275" is classified as ROL-0 per J-STD-004.
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24-7068-1406SAC305 48/66 Diameter .025 RoHS Compliant SAC305:
Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the user to get the most value for the money with minimal maintenance costs. Kester Ultrapure SAC305 Bar Solder was designed to minimize the amount of dross generated in a wave soldering, selective soldering or dip soldering process. Kester Ultrapure SAC305 is manufactured with virgin metals which meet the high standards of Kester Ultrapure line of bar solders.
When molten solder comes in contact with air, it forms metal oxides or dross. This dross mixes in with the solder in the upper layer of solder in the solder pot to form a pasty solder dross mixture. Many solder impurities have been known to contribute to dross formation - aluminum, cadmium, iron and zinc are the most common of these. The purity level of Kester Ultrapure SAC305 exceeds the industry requirements for allowable impurity levels, which helps control dross levels. Aside from exceptional control on solder purity, the Kester Ultrapure SAC305 manufacturing process integrates a low dross additive to minimize dross formation during the soldering process. Additionally, Kester employs an extrusion manufacturing technique to minimize oxidation and alloy segregation during the manufacturing process. Old-fashioned methods of casting individual bars lacks protection from the atmosphere in the molten state and exposes more surface area which produces correspondingly more oxide.
Kester Ultrapure SAC305 yields less dross, bright solder joints, and a reduction in defects in wave, selective and dip soldering processes.Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable soldering of most common metals. Kester 48 has performance characteristics far exceeding standard RA fluxes. Kester 48 builds on the performance of its predecessor Kester 44 with ?instant-action? wetting to provide fast and reliable solder joints.
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24-7068-7617SAC305 275/58 Diameter .025 RoHS Compliant SAC305:
Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the user to get the most value for the money with minimal maintenance costs. Kester Ultrapure SAC305 Bar Solder was designed to minimize the amount of dross generated in a wave soldering, selective soldering or dip soldering process. Kester Ultrapure SAC305 is manufactured with virgin metals which meet the high standards of Kester Ultrapure line of bar solders.
When molten solder comes in contact with air, it forms metal oxides or dross. This dross mixes in with the solder in the upper layer of solder in the solder pot to form a pasty solder dross mixture. Many solder impurities have been known to contribute to dross formation - aluminum, cadmium, iron and zinc are the most common of these. The purity level of Kester Ultrapure SAC305 exceeds the industry requirements for allowable impurity levels, which helps control dross levels. Aside from exceptional control on solder purity, the Kester Ultrapure SAC305 manufacturing process integrates a low dross additive to minimize dross formation during the soldering process. Additionally, Kester employs an extrusion manufacturing technique to minimize oxidation and alloy segregation during the manufacturing process. Old-fashioned methods of casting individual bars lacks protection from the atmosphere in the molten state and exposes more surface area which produces correspondingly more oxide.
Kester Ultrapure SAC305 yields less dross, bright solder joints, and a reduction in defects in wave, selective and dip soldering processes."275" No-Clean provides superior wetting performance leaving an extremely clear post-soldering residue. "275" is designed to be a low splattering core flux. "275" is classified as ROL-0 per J-STD-004.
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Kester SN96.5 AG3.0 CU0.5 48/66 SAC305 Activated Rosin Cored Wire Solder Dia. .020 ROHS (24-7068-1401
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Kester SN96.5 AG3.0 CU0.5 331/66 SAC305 Water-Soluble Cored Wire Solder Dia. .020 ROHS (24-7068-6401)
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Kester SN96.5 AG3.0 CU0.5 275/58 SAC305 No-Clean Cored Wire Solder Dia. .020 ROHS (24-7068-7603)
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DESCO 12791 BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 18INx24IN,100EA/PK
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MFG List Price: $64.95
Your Price: $52.95
Savings: $12.00!
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MFG List Price: $64.95
Your Price: $52.95
Savings: $12.00!
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MFG List Price: $64.95
Your Price: $52.95
Savings: $12.00!
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MFG List Price: $68.28
Your Price: $54.81
Savings: $13.47!
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24-7068-1401SAC305 48/66 Diameter .020 RoHS Compliant SAC305:
Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the user to get the most value for the money with minimal maintenance costs. Kester Ultrapure SAC305 Bar Solder was designed to minimize the amount of dross generated in a wave soldering, selective soldering or dip soldering process. Kester Ultrapure SAC305 is manufactured with virgin metals which meet the high standards of Kester Ultrapure line of bar solders.
When molten solder comes in contact with air, it forms metal oxides or dross. This dross mixes in with the solder in the upper layer of solder in the solder pot to form a pasty solder dross mixture. Many solder impurities have been known to contribute to dross formation - aluminum, cadmium, iron and zinc are the most common of these. The purity level of Kester Ultrapure SAC305 exceeds the industry requirements for allowable impurity levels, which helps control dross levels. Aside from exceptional control on solder purity, the Kester Ultrapure SAC305 manufacturing process integrates a low dross additive to minimize dross formation during the soldering process. Additionally, Kester employs an extrusion manufacturing technique to minimize oxidation and alloy segregation during the manufacturing process. Old-fashioned methods of casting individual bars lacks protection from the atmosphere in the molten state and exposes more surface area which produces correspondingly more oxide.
Kester Ultrapure SAC305 yields less dross, bright solder joints, and a reduction in defects in wave, selective and dip soldering processes.Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable soldering of most common metals. Kester 48 has performance characteristics far exceeding standard RA fluxes. Kester 48 builds on the performance of its predecessor Kester 44 with ?instant-action? wetting to provide fast and reliable solder joints.
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24-7068-6408SAC305 331/66 Diameter .020 RoHS Compliant SAC305:
Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the user to get the most value for the money with minimal maintenance costs. Kester Ultrapure SAC305 Bar Solder was designed to minimize the amount of dross generated in a wave soldering, selective soldering or dip soldering process. Kester Ultrapure SAC305 is manufactured with virgin metals which meet the high standards of Kester Ultrapure line of bar solders.
When molten solder comes in contact with air, it forms metal oxides or dross. This dross mixes in with the solder in the upper layer of solder in the solder pot to form a pasty solder dross mixture. Many solder impurities have been known to contribute to dross formation - aluminum, cadmium, iron and zinc are the most common of these. The purity level of Kester Ultrapure SAC305 exceeds the industry requirements for allowable impurity levels, which helps control dross levels. Aside from exceptional control on solder purity, the Kester Ultrapure SAC305 manufacturing process integrates a low dross additive to minimize dross formation during the soldering process. Additionally, Kester employs an extrusion manufacturing technique to minimize oxidation and alloy segregation during the manufacturing process. Old-fashioned methods of casting individual bars lacks protection from the atmosphere in the molten state and exposes more surface area which produces correspondingly more oxide.
Kester Ultrapure SAC305 yields less dross, bright solder joints, and a reduction in defects in wave, selective and dip soldering processes."331" is a high-activity water-soluble core flux for soldering difficult metals. "331" is designed for optimal cleanability, along with minimal smoke and odor. The residues from "331" must be removed. "331" is classified as 0RH1 per J-STD-004.
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24-7068-7603SAC305 275/58 Diameter .020 RoHS Compliant SAC305:
Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the user to get the most value for the money with minimal maintenance costs. Kester Ultrapure SAC305 Bar Solder was designed to minimize the amount of dross generated in a wave soldering, selective soldering or dip soldering process. Kester Ultrapure SAC305 is manufactured with virgin metals which meet the high standards of Kester Ultrapure line of bar solders.
When molten solder comes in contact with air, it forms metal oxides or dross. This dross mixes in with the solder in the upper layer of solder in the solder pot to form a pasty solder dross mixture. Many solder impurities have been known to contribute to dross formation - aluminum, cadmium, iron and zinc are the most common of these. The purity level of Kester Ultrapure SAC305 exceeds the industry requirements for allowable impurity levels, which helps control dross levels. Aside from exceptional control on solder purity, the Kester Ultrapure SAC305 manufacturing process integrates a low dross additive to minimize dross formation during the soldering process. Additionally, Kester employs an extrusion manufacturing technique to minimize oxidation and alloy segregation during the manufacturing process. Old-fashioned methods of casting individual bars lacks protection from the atmosphere in the molten state and exposes more surface area which produces correspondingly more oxide.
Kester Ultrapure SAC305 yields less dross, bright solder joints, and a reduction in defects in wave, selective and dip soldering processes."275" No-Clean provides superior wetting performance leaving an extremely clear post-soldering residue. "275" is designed to be a low splattering core flux. "275" is classified as ROL-0 per J-STD-004.
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BAG,STATSHIELD, PREMIUM, METAL IN, GREEN, 18INx24IN,100EA/PK
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Kester SN96.5 AG3.0 CU0.5 331/66 SAC305 Water-Soluble Cored Wire Solder Dia. .025 ROHS (24-7068-6417)
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Kester SN96.5 AG3.0 CU0.5 331/66 SAC305 Water-Soluble Cored Wire Solder Dia. .015 ROHS (24-7068-6422)
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Kester SN96.5 AG3.0 CU0.5 275/58 SAC305 No-Clean Cored Wire Solder Dia. .015 ROHS (24-7068-7608)
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DESCO 66057 MAT, STATFREE T2, RUBBER, GREEN, 0.060IN x 24 IN x 36 IN
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MFG List Price: $69.95
Your Price: $56.95
Savings: $13.00!
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MFG List Price: $70.95
Your Price: $57.95
Savings: $13.00!
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MFG List Price: $70.95
Your Price: $57.95
Savings: $13.00!
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MFG List Price: $95.83
Your Price: $76.93
Savings: $18.90!
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24-7068-6417SAC305 331/66 Diameter .025 RoHS Compliant SAC305:
Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the user to get the most value for the money with minimal maintenance costs. Kester Ultrapure SAC305 Bar Solder was designed to minimize the amount of dross generated in a wave soldering, selective soldering or dip soldering process. Kester Ultrapure SAC305 is manufactured with virgin metals which meet the high standards of Kester Ultrapure line of bar solders.
When molten solder comes in contact with air, it forms metal oxides or dross. This dross mixes in with the solder in the upper layer of solder in the solder pot to form a pasty solder dross mixture. Many solder impurities have been known to contribute to dross formation - aluminum, cadmium, iron and zinc are the most common of these. The purity level of Kester Ultrapure SAC305 exceeds the industry requirements for allowable impurity levels, which helps control dross levels. Aside from exceptional control on solder purity, the Kester Ultrapure SAC305 manufacturing process integrates a low dross additive to minimize dross formation during the soldering process. Additionally, Kester employs an extrusion manufacturing technique to minimize oxidation and alloy segregation during the manufacturing process. Old-fashioned methods of casting individual bars lacks protection from the atmosphere in the molten state and exposes more surface area which produces correspondingly more oxide.
Kester Ultrapure SAC305 yields less dross, bright solder joints, and a reduction in defects in wave, selective and dip soldering processes."331" is a high-activity water-soluble core flux for soldering difficult metals. "331" is designed for optimal cleanability, along with minimal smoke and odor. The residues from "331" must be removed. "331" is classified as 0RH1 per J-STD-004.
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24-7068-6422SAC305 331/66 Diameter .015 RoHS Compliant SAC305:
Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the user to get the most value for the money with minimal maintenance costs. Kester Ultrapure SAC305 Bar Solder was designed to minimize the amount of dross generated in a wave soldering, selective soldering or dip soldering process. Kester Ultrapure SAC305 is manufactured with virgin metals which meet the high standards of Kester Ultrapure line of bar solders.
When molten solder comes in contact with air, it forms metal oxides or dross. This dross mixes in with the solder in the upper layer of solder in the solder pot to form a pasty solder dross mixture. Many solder impurities have been known to contribute to dross formation - aluminum, cadmium, iron and zinc are the most common of these. The purity level of Kester Ultrapure SAC305 exceeds the industry requirements for allowable impurity levels, which helps control dross levels. Aside from exceptional control on solder purity, the Kester Ultrapure SAC305 manufacturing process integrates a low dross additive to minimize dross formation during the soldering process. Additionally, Kester employs an extrusion manufacturing technique to minimize oxidation and alloy segregation during the manufacturing process. Old-fashioned methods of casting individual bars lacks protection from the atmosphere in the molten state and exposes more surface area which produces correspondingly more oxide.
Kester Ultrapure SAC305 yields less dross, bright solder joints, and a reduction in defects in wave, selective and dip soldering processes."331" is a high-activity water-soluble core flux for soldering difficult metals. "331" is designed for optimal cleanability, along with minimal smoke and odor. The residues from "331" must be removed. "331" is classified as 0RH1 per J-STD-004.
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24-7068-7608SAC305 275/58 Diameter .015 RoHS Compliant SAC305:
Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the user to get the most value for the money with minimal maintenance costs. Kester Ultrapure SAC305 Bar Solder was designed to minimize the amount of dross generated in a wave soldering, selective soldering or dip soldering process. Kester Ultrapure SAC305 is manufactured with virgin metals which meet the high standards of Kester Ultrapure line of bar solders.
When molten solder comes in contact with air, it forms metal oxides or dross. This dross mixes in with the solder in the upper layer of solder in the solder pot to form a pasty solder dross mixture. Many solder impurities have been known to contribute to dross formation - aluminum, cadmium, iron and zinc are the most common of these. The purity level of Kester Ultrapure SAC305 exceeds the industry requirements for allowable impurity levels, which helps control dross levels. Aside from exceptional control on solder purity, the Kester Ultrapure SAC305 manufacturing process integrates a low dross additive to minimize dross formation during the soldering process. Additionally, Kester employs an extrusion manufacturing technique to minimize oxidation and alloy segregation during the manufacturing process. Old-fashioned methods of casting individual bars lacks protection from the atmosphere in the molten state and exposes more surface area which produces correspondingly more oxide.
Kester Ultrapure SAC305 yields less dross, bright solder joints, and a reduction in defects in wave, selective and dip soldering processes."275" No-Clean provides superior wetting performance leaving an extremely clear post-soldering residue. "275" is designed to be a low splattering core flux. "275" is classified as ROL-0 per J-STD-004.
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MAT, STATFREE T2, RUBBER, GREEN, 0.060IN x 24 IN x 36 IN
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Kester EnviroMark 828 Water-Soluble Stencil Printing, Type 3, 89.5 Percent Metal Solder Paste Sn96.5Ag3.0Cu0.5 500 Gram Jar 55-3843-2209
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Kester EnviroMark 907 No-Clean Stencil Printing, Type 3, 88.5 Percent Metal Solder Paste Sn96.5Ag3.0Cu0.5 500 Gram Jar 57-3043-9909
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DESCO 66058 MAT, STATFREE T2, RUBBER, GREEN, 0.060IN x 24 IN x 48 IN
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Kester EnviroMark 828 Water-Soluble Stencil Printing, Type 3, 89.5 Percent Metal Solder Paste Sn96.5Ag3.0Cu0.5 600 Gram Cartridge 55-3843-2213
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MFG List Price: $191.95
Your Price: $88.90
Savings: $103.05!
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MFG List Price: $191.95
Your Price: $88.90
Savings: $103.05!
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MFG List Price: $114.52
Your Price: $91.94
Savings: $22.58!
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MFG List Price: $229.95
Your Price: $106.68
Savings: $123.27!
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Kester EnviroMark 828 Water-Soluble Stencil Printing, Type 3, 89.5% Metal Solder Paste Sn96.5Ag3.0Cu0.5 500 Gram Jar (57-3843-2209)
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Kester EnviroMark 907 No-Clean Stencil Printing, Type 3, 88.5% Metal Solder Paste Sn96.5Ag3.0Cu0.5 500 Gram Jar (57-3043-9909)
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MAT, STATFREE T2, RUBBER, GREEN, 0.060IN x 24 IN x 48 IN
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Kester EnviroMark 828 Water-Soluble Stencil Printing, Type 3, 89.5% Metal Solder Paste Sn96.5Ag3.0Cu0.5 600 Gram Cartridge (57-3843-2213
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Kester EnviroMark 907 No-Clean Stencil Printing, Type 3, 88.5 Percent Metal Solder Paste Sn96.5Ag3.0Cu0.5 600 Gram Cartridge 57-3201-9913
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DESCO 66120 ROLL, STATFREE T2, RUBBER, GREEN, 0.060IN x 24 IN x 24FT
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DESCO 66121 ROLL, STATFREE T2, RUBBER, GREEN, 0.060IN x 30 IN x 24FT
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DESCO 66122 ROLL, STATFREE T2, RUBBER, GREEN, 0.060IN x 36 IN x 24FT
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MFG List Price: $229.95
Your Price: $106.68
Savings: $123.27!
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MFG List Price: $422.47
Your Price: $339.14
Savings: $83.33!
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MFG List Price: $517.64
Your Price: $415.55
Savings: $102.09!
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MFG List Price: $613.34
Your Price: $492.36
Savings: $120.98!
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Kester EnviroMark 907 No-Clean Stencil Printing, Type 3, 88.5% Metal Solder Paste Sn96.5Ag3.0Cu0.5 600 Gram Cartridge (57-3201-9913)
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ROLL, STATFREE T2, RUBBER, GREEN, 0.060IN x 24 IN x 24FT
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ROLL, STATFREE T2, RUBBER, GREEN, 0.060IN x 30 IN x 24FT
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ROLL, STATFREE T2, RUBBER, GREEN, 0.060IN x 36 IN x 24FT
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DESCO 66123 ROLL, STATFREE T2, RUBBER, GREEN, 0.060IN x 48 IN x 24FT
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MFG List Price: $802.08
Your Price: $643.86
Savings: $158.22!
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ROLL, STATFREE T2, RUBBER, GREEN, 0.060IN x 48 IN x 24FT
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