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Home > Shop by Brand > Kester Brand
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Kester 920-CFX No Clean Soldering Flux
Kester 63-0346-0920 - 920-CXF No-Clean Soldering Flux, 1 Gallon
Price: $0.01
Ground Shipping Hazmat Charge Per Box $33.00
Kester 63-0346-0920 is a 920CFX no clean, low solid soldering flux that comes in a one gallon container.  This flux is non-conductive and non-corrosive and leaves essentially no residue after soldering.  Thus, it eliminates the need for cleaning and is suitable for soldering bare copper.
Kester Replacement Flux Pen Tips
Kester 53-0000-0225 are replacement flux pen tips.  25 tips per pack. Kester 83-1000-0186 is a flux pen that is a unique tool for rework and touch-up soldering.  It allows a controlled application of flux, eliminating the mess from flux bottles.  Flux-Pens are ideally suited for typical hand-soldering applications. Kester 83-1000-0951 is a 951 No-Clean halogen-free, non-rosin organic flux pen designed for wave soldering conventional and surface mount circuit board assemblies. Kester 83-1046-0952 is a 952-D6 No-Clean flux pen. This flux pen was designed specifically for lead-bearing and lead-free alloys.  This no-clean, non-corrosive, halide free flux pen is for rework of conventional and surface mount circuit board assemblies.
Kester Ultrapure Bar Solder Kester Ultrapure Solder Bar Kester Leaded Solder Chips
Kester 83-1097-2331 is a 2331-ZX  an Organic Water-Soluble Flux Pen with Neutral pH.  It is the preferred OA flux for tin-lead and lead free rework of conventional and surface mount circuit board assemblies.
Kester 04-6040-0050, SN60PB40 is Ultrapure Leaded Bar Solder. 60 percent Tin and 50 percent Lead. This item is sold by the box in 25 lb increments.

Kester 04-6337-0050 is Solid Ultrapure Bar Solder. This solder is comprised of SN63PB37 or, 63 percent tin and 37 percent lead. Please note, this item is sold by the box and has a 25 lb minimum.

Kester 04-6337-2050 are SN63PB37  Solid Ultrapure Bar Solder Chips.  This solder is comprised of SN63 (Tin) and PB37 (Lead).  It is manufactured by a special process that controls the inclusions of oxides and metallic and non-metallic impurities.
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